What is the principle and detection method of 3D SPI?

The positioning of the SPI solder paste detector equipment is a quality control and analysis tool. Although it detects the height, volume, area, short circuit and offset of the solder paste, its detection data is more important. The SPI equipment provides quality control personnel with analysis data of the inspection content, so that the changing trend and law of the inspection content such as the height and volume of the solder paste can be obtained from the data, so that the equipment can be adjusted before printing to reduce the defect rate.

What are the capabilities of the SPI solder paste inspection machine? Can you check out those solder paste printing defects? The solder paste inspection machine can only perform surface image inspection. If there is an area covered by an object, it cannot be inspected. However, the timing of the solder paste inspection machine should be before the parts are placed, so there will be no tin It happens that the paste is covered.

The solder paste inspection machine can measure the following data: solder paste printing volume, solder paste printing height, solder paste printing area/volume, solder paste printing flatness.

The solder paste inspection machine can detect the following defects: whether the solder paste printing is offset, whether the solder paste printing has a height deviation (pointing), whether the solder paste printing is bridging, whether the solder paste printing is defective or damaged.

In summary, a machine is a machine, and a person is still the key. SPI is a set of tools. If used well, it can help improve product quality, thereby increasing production and reducing costs. If it is just placed there, and if you encounter an alarm, press it to continue, then SPI will only If the output is affected, SPI issues an alarm, and it is necessary to check the printing quality of the board to minimize the defect rate.